Extec have a wealth of experience in placing bare-die components onto FR4 and other types of circuit board. The die are attached using either epoxy or polyimide and sometimes with solder. The die are then wire-bonded to pads, specially gold plated with a soft gold.

The die is covered with a silicone or epoxy, depending on the application, to protect the die and wire bonds.

The remaining components are then surface-mounted in the normal way.