| Capabilities |
| Standard | 96% Alumina |
| Power Applications | Aluminium Nitride |
| Maximum Substrate Size | 6 x 4 Inches |
| Wire Bondable | Gold | 4-7 mOhms/Square |
| Solderable | Palladium-Silver | 20-30 mOhms/Square |
| Solderable Over Gold | Platinum-Gold | 50-60 mOhms/Square |
| Standard Track/Gap | 0.010" width, 0.010" spacing | |
| Conductor Layers | 6 Each Side | |
| Through-Printed Holes | Gold, | <20 mOhms Thru-hole |
| (Double Sided Printing) | Palladium, Silver | <50 mOhms Thru-hole |
| Range | <1 OHM To >50 MOhms | |
| <10 Ohms | +/-0.5 Ohms | |
| 10 To 100 Ohms | +/-0.5% | |
| 100 Ohms To 300 KOhms | +/-0.3% | |
| > 300 KOhms | +/-0.5% | |
| Stability | 100 Ohms to 1MOhm | +/-0.5% |
| Absolute TCR Standard | +/- 100ppm/degree C | |
| Absolute TCR Special | +/- 50ppm/degree C | |
| Matching | Mid-Range Values | +/-0.1% |
| Power Dissipation | 50 Watts/SQ-Inch Nominal | |
| Adjust On Test Facility | Active trim of circuit function (R or C) | |
| Close Tolerance Resistors | Thin film chip resistors | |
| to 0.02% Absolute, 0.01% Matching |
| Gold | Thermasonic, 0.0007 to 0.002 inch dia. |
| Aluminium | Ultrasonic, 0.0007 to 0.002 inch dia. |
| Aluminium Power | Ultrasonic, 0.005 to 0.025 inch dia. |
| Chip And Wire | Transistors, FETs, Diodes |
| Digital and analogue ICs | |
| Microprocessors and Memory | |
| Thin Film Resistors | |
| Inductors, Transformers, Crystals | |
| Capacitors, Ceramic, Tantalum or MOS | |
| Solder Surface-Mount | All the above mounted as small-outline |
| plastic packs, LCC or PLCC, D-packs | |
| (Power Devices) Chip Resistors |
| MIL Spec Chip And Wire | Seam-sealed metal packs |
| MIL Spec Chip And Wire | Epoxy-sealed ceramic packs |
| Industrial Spec Chip And Wire | Silicone bond protected, Epoxy coated |
| Industrial And Commercial | Epoxy Coated |
| Surface-Mount | Epoxy Coated |
| Format | Dual-In-Line |
| Single-In-Line | |
| Double Sided, Mixed Build | |
| Customised Format (To suit application) |
| Fine/Gross Leak | <5 x 10^8 ATT CC/S |
| Acceleration (Steady State) | 5000G |
| Rapid Change Of Temperature | -65 DEG C To +150 DEG C, 5 Cycles |
| Burn-In | 160 Hours at +125 DEG C, Powered |
| Functional Tests at 25 C | To customers specifications |
| Temperature Tests (Sample) | T max and T min as required |
| Pin Grid Array Hybrids | Customised packaging |
| Double-Sided Hybrids | Print through or clip round |
| Resistors On Dielectric | Allows tracking under resistors |
| Fine Line And Space | 0.004 Inch line and space |
| (Conventional printing) | |
| 0.002 inch line, 0.001 inch space | |
| (New method, patent applied for) | |
| Glass Windows In Metal | Mounting of photodevices or EPROM |
| or ceramic | |
| Militarised Ceramic Hybrids | Using soldered metal frame lids |
| High Temperature Hybrids | Up to 200 DEG C |
| Power Hybrids | High dissipating devices |
